Hybrid Microcircuit Ceramic Packages

Hybrid microcircuits are designed in a variety of hermetic packages kovar aluminum ceramic and include flatpacks that can be surface mounted.

Hybrid microcircuit ceramic packages.

Hybrid microcircuit technology handbook. Leadless chip carriers lcc side. Resistors inductors transformers and capacitors bonded to a substrate or printed circuit board pcb. Assembly technology utilizes a range of substrate materials alumina duroid tantalum nitride as well as eutectic or epoxy die attach techniques.

Popular in the 19 0s and 1980s hybrid microcircuits figure 1. Resistor trimming wire bonding die attachment cleaning hermetic sealing and moisture analysis. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Current hybrid technology generally consists of fabricating and assembling passive and active components in a single small enclosure which is usually made hermetic.

A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g. Examples of such enclosures are ceramic and metal packages which are 1 4 square or 1 having 14 or 30 leads. Hybrid microcircuit packaging part i by christopher henderson in this section we ll provide an overview of hybrid microcircuit packaging. Ceramic small outline packages csop cerquads eija and jedec.

The hybrid microcircuit technology handbook integrates the many diverse technologies used in the design fabrication assembly and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. J lead chip carriers ceramic. Power transistor outline to packages. Hybrid microcircuits consist of a mix of devices in a single package.

Hybrid packages ceramic and metal hybrid packages are special carriers of hybrid microcircuits and other components interconnected as one unit or as a component of an electronic subsystem. Materials processes design testing and production james j licari leonard r enlow integrates the many diverse technologies used in the design fabrication assembly and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. It is a miniaturized electronic circuit constructed of individual devices such as transistors diodes or monolithic ics and passive components such as resistors inductors transformers and capacitors bonded to a substrate. Transistors diodes or monolithic ics and passive components e g.